ST7FLITE25M6TR STMicroelectronics, ST7FLITE25M6TR Datasheet - Page 120
![IC MCU 8BIT 8K FLASH 20-SOIC](/photos/6/56/65691/497-20-soic__7_5mm_width__series_sml.jpg)
ST7FLITE25M6TR
Manufacturer Part Number
ST7FLITE25M6TR
Description
IC MCU 8BIT 8K FLASH 20-SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Specifications of ST7FLITE25M6TR
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
ST7FLITE2x
Core
ST7
Data Bus Width
8 bit
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
For Use With
497-5858 - EVAL BOARD PLAYBACK ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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ST7LITE2
PACKAGE CHARACTERISTICS (Cont’d)
Table 21. THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
chip internal power (I
120/133
Symbol
P
T
R
Dmax
Jmax
thJA
DD
xV
DD
Package thermal resistance
(junction to ambient)
Maximum junction temperature
Power dissipation
) and P
PORT
is the port power dissipation depending on the ports used in the application.
2)
Ratings
1)
D
= (T
J
-T
DIP20
A
SO20
) / R
thJA
.
D
=P
INT
Value
125
150
500
63
+P
PORT
where P
INT
°C/W
Unit
mW
°C
is the
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