STR755FR1H6 STMicroelectronics, STR755FR1H6 Datasheet - Page 78
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STR755FR1H6
Manufacturer Part Number
STR755FR1H6
Description
MCU 32BIT 128KB FLASH 64LFBGA
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet
1.STR750FV0T6.pdf
(84 pages)
Specifications of STR755FR1H6
Core Processor
ARM7
Core Size
32-Bit
Speed
60MHz
Connectivity
I²C, SPI, SSI, SSP, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LFBGA
For Use With
MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5748 - BOARD EVALUATION FOR STR750XF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STR755FR1H6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Package characteristics
Figure 48. 100-ball low profile fine pitch ball grid array package
78/84
Figure 49. Recommended PCB design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
1.
Dim.
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
N
Values in inches are converted from mm and rounded to 4 decimal
digits.
b
e
F
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
0.270
0.45
9.85
9.85
Min
1.085
10.00
10.00
0.30
0.50
7.20
7.20
0.80
1.40
mm
Typ
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
Number of Balls
1.700
10.15
10.15
Max
0.80
0.55
0.12
0.15
0.08
100
0.0106
0.0177 0.0197 0.0217
0.3878 0.3937 0.3996
0.3878 0.3937 0.3996
Min
inches
0.0427
0.0118
0.2835
0.2835
0.0315
0.055
Typ
(1)
0.0669
0.0315
0.005
0.006
0.003
Max