STM32F103R6T6 STMicroelectronics, STM32F103R6T6 Datasheet - Page 72
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STM32F103R6T6
Manufacturer Part Number
STM32F103R6T6
Description
MCU ARM 32KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103C4T6A.pdf
(87 pages)
Specifications of STM32F103R6T6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
497-10048 - BOARD EVAL ACCELEROMETER497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-6064
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103R6T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM32F103R6T6A
Manufacturer:
ST
Quantity:
611
Company:
Part Number:
STM32F103R6T6A
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
72/87
Figure 35. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 36. Power supply and reference decoupling (V
1. The V
pad capacitance (roughly 7 pF). A high C
this, f
parasitic
ADC
V AIN
REF+
Table 46
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
R AIN (1)
input is available only on the TFBGA64 package.
for the values of R
C parasitic
AINx
REF+
is connected to V
Doc ID 15060 Rev 5
AIN
V DD
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
and C
value will downgrade conversion accuracy. To remedy
ADC
I L ±1 µA
DDA
.
or not. The 10 nF capacitors should be
R ADC (1)
Sample and hold ADC
converter
inFigure 36
REF+
STM32F103x4, STM32F103x6
C ADC (1)
STM32F103xx
converter
not connected to
12-bit
or
Figure
37,
ai14150c
V
DDA
)