STM32F107RCT6 STMicroelectronics, STM32F107RCT6 Datasheet - Page 75

MCU ARM 256KB FLASH MEM 64-LQFP

STM32F107RCT6

Manufacturer Part Number
STM32F107RCT6
Description
MCU ARM 256KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F107RCT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F107x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
51
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8914

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STM32F105xx, STM32F107xx
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 36. Power supply and reference decoupling (V
1. V
Figure 37. Power supply and reference decoupling (V
1. V
REF+
REF+
and V
and V
REF–
REF–
1 µF // 10 nF
inputs are available only on 100-pin packages.
inputs are available only on 100-pin packages.
REF+
is connected to V
Doc ID 15274 Rev 5
1 µF // 10 nF
1 µF // 10 nF
DDA
or not. The 10 nF capacitors should be
V
V
V REF+
V DDA
V SSA /V REF-
STM32F10xxx
(See note 1)
REF+
REF–
(See note 1)
(See note 1)
(See note 1)
STM32F10xxx
/V
/V
REF+
REF+
Figure 36
SSA
DDA
not connected to
connected to
Electrical characteristics
or
Figure
ai14381c
ai14380c
V
DDA
37,
V
DDA
)
75/101
)

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