STR912FAW44X6 STMicroelectronics, STR912FAW44X6 Datasheet - Page 91

MCU 512KB FLASH 96K RAM 128LQFP

STR912FAW44X6

Manufacturer Part Number
STR912FAW44X6
Description
MCU 512KB FLASH 96K RAM 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR912FAW44X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Dc
1020
For Use With
497-8267 - BOARD EVAL BASED ON STR9497-8262 - BOARD EVAL BASED ON STR912FAMCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6284

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STR91xFAxxx
Table 48.
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev G. Refer to
3. Value obtained on conversions started by trigger in single mode
4. All sucessive conversions in continuous and scan modes.
Table 49.
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev H and higher. Refer to
3. Value obtained from conversions started by trigger in single mode
4. All successive conversions in continuous and scan modes.
5. Conversion started by trigger when automatic clock gated mode enabled. Fast trigger mode is available only in devices with
6. Value obtained from conversions started by fast trigger in single mode
t
CONV(FT]
Symbol
t
t
Symbol
t
t
TR(FT)
CONV(S]
CONV(C]
CONV(S]
CONV(C]
TR(S)
TR(C)
TR(S)
TR(C)
and to
memory and to
silicon Rev H and higher.
Section 8: Device
Single mode conversion time
Single mode throughput rate
Continuous mode conversion time
Continuous mode throughput rate
Single mode conversion time
Single mode throughput rate
Continuous mode conversion time
Continuous mode throughput rate
Fast trigger mode conversion time
Fast trigger mode throughput rate
ADC conversion time (silicon Rev G)
ADC conversion time (silicon Rev H and higher)
Section 8: Device
Parameter
Parameter
marking.
marking.
(1) (2)
(1) (2)
(3)
(3)
(6)
(4)
(4)
(5)
Doc ID 13495 Rev 6
f
f
f
f
f
f
f
f
f
f
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
conditions
conditions
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
Test
Test
Table 5
2*16/f
1*16/f
for device rev identification in OTP memory
1.33
0.66
Min
Min
100
Table 5
ADC
ADC
for device rev identification in OTP
1*16/f
1*16/f
1*16/f
Value
Value
1500
1500
0.66
0.66
0.66
Typ
Typ
Electrical characteristics
ADC
ADC
ADC
3*16/f
2*16/f
1200
Max
Max
1.33
500
750
2
ADC
ADC
ksps
ksps
ksps
ksps
ksps
Unit
Unit
91/102
µs
µs
µs
µs
µs
µs
µs
µs

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