STR912FAW46X6 STMicroelectronics, STR912FAW46X6 Datasheet - Page 64

MCU ARM9 1024KB FLASH 128LQFP

STR912FAW46X6

Manufacturer Part Number
STR912FAW46X6
Description
MCU ARM9 1024KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR912FAW46X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
STR9
Device Core
ARM966E-S
Device Core Size
16/32Bit
Frequency (max)
96MHz
Total Internal Ram Size
96KB
# I/os (max)
80
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2/3.6V
Operating Supply Voltage (min)
1.65/1.77/2.5/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-9038
STR912FAW46X6

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Electrical characteristics
7.6
64/102
Supply current characteristics
V
Table 15.
1. ARM core and peripherals active with all clocks on. Power can be conserved by turning off clocks to
2. mA/MHz data valid down to 10 MHz. Below this frequency the ratio mA/MHz increases.
3. ARM core stopped and all peripheral clocks active.
4. ARM core stopped and all peripheral clocks stopped.
5. Results based on characterization, not tested in production.
I
I
I
I
I
I
DDRUN
IDLE
SLEEP(IDD)
SLEEP(IDDQ)
RTC_STBY
SRAM_STBY
DDQ
Symbol
peripherals which are not required.
= 2.7 - 3.6 V, V
Supply current characteristics
Run mode current
Idle mode current
Sleep mode
current, I
Sleep mode
current, I
RTC Standby
current
SRAM Standby
current
Parameter
DD
DD
DDQ
= 1.65 - 2 V, T
Doc ID 13495 Rev 6
All peripherals on
All peripherals off
All peripherals on
All peripherals off
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD off
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD on
LVD On
LVD Off
Measured on VBATT pin
Measured on VBATT pin
Test conditions
A
(4)
(4)
= -40 / 85 °C unless otherwise specified.
(1)(2)
(1)(2)
(2)(4)
(2)(3)
Min
Value
1.14
0.45
Typ
1.7
1.3
0.9
50
55
7
7
5
820
825
80
70
Max
0.75
240
2.3
1.6
1.7
1.2
STR91xFAxxx
(5)
(5)
(5)
(5)
mA/MHz
mA/MHz
mA/MHz
Unit
µA
µA
µA
µA
µA

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