MC9S08QD2MSCR Freescale Semiconductor, MC9S08QD2MSCR Datasheet - Page 189

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MC9S08QD2MSCR

Manufacturer Part Number
MC9S08QD2MSCR
Description
IC MCU 8BIT 8-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08QD2MSCR

Core Processor
HCS08
Core Size
8-Bit
Speed
16MHz
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
4
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOIC (3.9mm Width)
Processor Series
S08QD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
128 B
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08QD4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
 Details
1
2
A.10 Flash Specifications
This section provides details about program/erase times and program-erase endurance for the flash
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see the Memory section.
Freescale Semiconductor
1
2
3
4
Zero-Scale Error
Full-Scale Error
Quantization Error
Supply voltage for program/erase
–40°C to 125°C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
Typical values assume V
only and are not tested in production.
At 4 MHz, for maximum frequency, use proportionally lower source impedance.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
Typical endurance for flash was evaluated for this product family on the 9S12Dx64. For additional information on how
Freescale defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25°C using the Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer
to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
The frequency of this clock is controlled by a software setting.
Characteristic
T
T = 25°C
L
to T
H
= –40°C to + 125°C
4
2
(2)
Characteristic
10 bit mode
8 bit mode
10 bit mode
8 bit mode
10 bit mode
1
DDAD
3
= 5.0 V, Temp = 25°C, f
(2)
Conditions
Table A-10. ADC Characteristics (continued)
(2)
MC9S08QD4 Series MCU Data Sheet, Rev. 6
Table A-11. Flash Characteristics
ADCK
Symb
E
E
E
=1.0 MHz unless otherwise stated. Typical values are for reference
V
Symbol
ZS
FS
Q
prog/erase
V
f
t
t
t
t
t
t
FCLK
Mass
D_ret
Burst
Page
Fcyc
Read
prog
Min
0
0
0
0
10,000
Min
150
2.7
2.7
15
5
Typ
±1.5
±0.5
±1.0
±0.5
1
100,000
Typical
20,000
4000
100
Appendix A Electrical Characteristics
Max
±3.1
±0.7
±1.5
±0.5
±0.5
9
4
Unit
LSB
LSB
LSB
Max
6.67
200
5.5
5.5
V
V
8 bit mode is
not truncated
ADIN
ADIN
Comment
DD
cycles
= V
= V
years
supply.
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
SSA
DDA
189

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