MC9S08AC8MFJE Freescale Semiconductor, MC9S08AC8MFJE Datasheet - Page 32
![IC MCU 8BIT 8K FLASH 32-LQFP](/photos/12/33/123395/mc9s08ac8mfje_sml.jpg)
MC9S08AC8MFJE
Manufacturer Part Number
MC9S08AC8MFJE
Description
IC MCU 8BIT 8K FLASH 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08AC8CFGE.pdf
(336 pages)
Specifications of MC9S08AC8MFJE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
32-LQFP
Processor Series
S08AC
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08AC8MFJE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Chapter 2 Pins and Connections
2.3.1
V
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the paired V
power pins as practical to suppress high-frequency noise. The MC9S08AC16 has a second V
pin should be connected to the system ground plane or to the primary V
connection.
V
the ADC module. A 0.1-μF ceramic bypass capacitor should be located as near to the analog power pins
as practical to suppress high-frequency noise.
2.3.2
Out of reset the MCU uses an internally generated clock (self-clocked mode — f
about 8-MHz crystal rate. This frequency source is used during reset startup and can be enabled as the
clock source for stop recovery to avoid the need for a long crystal startup delay. This MCU also contains
a trimmable internal clock generator (ICG) module that can be used to run the MCU. For more information
on the ICG, see the
The oscillator in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic resonator in
either of two frequency ranges selected by the RANGE bit in the ICGC1 register. Rather than a crystal or
ceramic resonator, an external oscillator can be connected to the EXTAL input pin.
Refer to
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
value is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to
humidity and lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance which
is the series combination of C1 and C2 which are usually the same size. As a first-order approximation,
use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and
XTAL).
2.3.3
RESET is a dedicated pin with a pullup device built in. It has input hysteresis, a high current output driver,
and no output slew rate control. Internal power-on reset and low-voltage reset circuitry typically make
32
F
DD
DDAD
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its
and V
and V
Figure 2-5
Power (V
Oscillator (XTAL, EXTAL)
RESET
SS
SSAD
are the primary power supply pins for the MCU. This voltage source supplies power to all
Chapter 8, “Internal Clock Generator
are the analog power supply pins for the MCU. This voltage source supplies power to
for the following discussion. R
DD
, 2 x V
MC9S08AC16 Series Data Sheet, Rev. 8
SS
, V
DDAD
, V
S
SSAD
(when used) and R
(S08ICGV4).”
)
F
SS
should be low-inductance
pin through a low-impedance
Self_reset
Freescale Semiconductor
) equivalent to
DD
SS
and V
pin. This
SS
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