MC9S08AC32CFUE Freescale Semiconductor, MC9S08AC32CFUE Datasheet - Page 288

• Manufacturer Part Number: MC9S08AC32CFUE
• Description: IC MCU 8BIT 32K FLASH 64-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC32CFUE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-QFP
• Processor Series: S08AC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 2KB
• # I/os (max): 54
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 16 Development Support
16.2.3
BDC commands are sent serially from a host computer to the BKGD pin of the target HCS08 MCU. All
commands and data are sent MSB-first using a custom BDC communications protocol. Active background
mode commands require that the target MCU is currently in the active background mode while
non-intrusive commands may be issued at any time whether the target MCU is in active background mode
or running a user application program.
Table 16-1
meaning of each command.
Coding Structure Nomenclature
This nomenclature is used in
288
AAAA
WBKP
WD16
RBKP
RD16
WD
RD
CC
SS
d
/
shows all HCS08 BDC commands, a shorthand description of their coding structure, and the
BDC Commands
=
=
=
=
=
=
=
=
=
=
=
Commands begin with an 8-bit hexadecimal command code in the host-to-target
direction (most significant bit first)
separates parts of the command
delay 16 target BDC clock cycles
a 16-bit address in the host-to-target direction
8 bits of read data in the target-to-host direction
8 bits of write data in the host-to-target direction
16 bits of read data in the target-to-host direction
16 bits of write data in the host-to-target direction
the contents of BDCSCR in the target-to-host direction (STATUS)
8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)
Table 16-1
MC9S08AC60 Series Data Sheet, Rev. 2
to describe the coding structure of the BDC commands.
Freescale Semiconductor