MC9S08AC32CFUE Freescale Semiconductor, MC9S08AC32CFUE Datasheet - Page 318

• Manufacturer Part Number: MC9S08AC32CFUE
• Description: IC MCU 8BIT 32K FLASH 64-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC32CFUE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-QFP
• Processor Series: S08AC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 2KB
• # I/os (max): 54
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1
2
Appendix A Electrical Characteristics and Timing Specifications
A.9.1
318
Num
Typical values are based on characterization data at V
Self-clocked mode frequency is the frequency that the DCO generates when the FLL is open-loop.
10
11
12
13
14
15
16
17
18
1
2
3
4
5
6
7
8
9
C
T
T
T
T
T
P
T
T
P
T
T
T
T
T
T
T
T
P
ICG Frequency Specifications
(V
Oscillator crystal or resonator (REFS = 1)
Input clock frequency (CLKS = 11, REFS = 0)
Input clock frequency (CLKS = 10, REFS = 0)
Internal reference frequency (untrimmed)
Duty cycle of input clock (REFS = 0)
Output clock ICGOUT frequency
Minimum DCO clock (ICGDCLK) frequency
Maximum DCO clock (ICGDCLK) frequency
Self-clock mode (ICGOUT) frequency
Self-clock mode reset (ICGOUT) frequency
Loss of reference frequency
Loss of DCO frequency
Crystal start-up time
FLL lock time
FLL frequency unlock range
FLL frequency lock range
ICGOUT period jitter,
Internal oscillator deviation from trimmed
DDA
(Fundamental mode crystal or ceramic resonator)
Low range
High range
Low range
High range
CLKS = 10, REFS = 0
All other cases
Low range
High range
Low range
High range
Low range
High range
Long term jitter (averaged over 2 ms interval)
frequency
V
V
High Gain, FBE (HGO = 1,CLKS = 10)
High Gain, FEE (HGO = 1,CLKS = 11)
Low Power, FBE (HGO = 0, CLKS = 10)
Low Power, FEE (HGO = 0, CLKS = 11)
DD
DD
= V
= 2.7 – 5.5 V, (constant temperature)
= 5.0 V ±10%, –40° C to 125°C
DDA
9
, 7
(min) to V
Characteristic
Table A-11. ICG Frequency Specifications
5, 6
, 8
4
measured at f
MC9S08AC60 Series Data Sheet, Rev. 2
DDA
3
(max), Temperature Range = –40 to 125°C Ambient)
DD
2
ICGOUT
= 5.0V, 25°C unless otherwise stated.
Max
f
f
ICGDCLKmax
ICGDCLKmin
f
f
Symbol
ICGIRCLK
f
Self_reset
fhi_byp
fhi_eng
flp_byp
flp_eng
n
ACC
ICGOUT
f
t
C
t
t
n
hi_eng
f
t
f
f
CSTH
Unlock
CSTL
Lockh
f
Extal
Lockl
LOR
LOD
t
Self
Lock
flo
Jitter
f
dc
lo
int
f
f
ICGDCLKmin
Extal
f
182.25
lo
–4*N
–2*N
Min
5.5
0.5
32
32
40
(min)
50
—
—
—
—
—
—
—
1
2
1
2
2
0
8
5
(min)
Typ
± 0.5
±0.5
243
430
—
—
—
—
—
—
—
—
—
—
—
8
4
Freescale Semiconductor
1
f
f
ICGDCLKmax
f
ICGDCLKmax
Extal
303.75
max)
Max
10.5
100
100
500
4*N
2*N
1.5
0.2
16
10
10
40
60
40
25
—
—
±2
±2
8
8
2
2
(max)
(
counts
counts
% f
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
Unit
kHz
kHz
kHz
kHz
ms
ms
%
%
ICG