HD64F36912GFH Renesas Electronics America, HD64F36912GFH Datasheet - Page 7

IC H8 MCU FLASH 8K 32-QFP

HD64F36912GFH

Manufacturer Part Number
HD64F36912GFH
Description
IC H8 MCU FLASH 8K 32-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F36912GFH

Core Processor
H8/300H
Core Size
16-Bit
Speed
12MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
32-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F36912GFH
Manufacturer:
Renesas Electronics America
Quantity:
10 000
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
CPU and System-Control Modules
On-Chip Peripheral Modules
Configuration of This Manual
Rev. 3.00 Sep. 14, 2006 Page v of xxviii

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