C8051F019-GQ Silicon Laboratories Inc, C8051F019-GQ Datasheet - Page 19
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C8051F019-GQ
Manufacturer Part Number
C8051F019-GQ
Description
IC 8051 MCU 16K FLASH 48TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F018r
Specifications of C8051F019-GQ
Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
48-TQFP, 48-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
16
Ram Size
1.25K x 8
Voltage - Supply (vcc/vdd)
2.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
1.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
16
Number Of Timers
4
Operating Supply Voltage
2.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F005DK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
No. Of I/o's
16
Ram Memory Size
1.25KB
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1198
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F019-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
C8051F019-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
4. PINOUT AND PACKAGE DEFINITIONS
19
VDD
DGND
AV+
AGND
TCK
TMS
TDI
TDO
XTAL1
XTAL2
/RST
VREF
CP0+
CP0-
CP1+
CP1-
NC
NC
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
Name
C8051F018
C8051F019
F018
31,
40,
30,
41,
16,
62
61
17
15
22
21
28
29
18
19
20
64
63
10
11
12
13
14
5,
6
4
3
2
1
7
8
9
Type
F019
23,
22,
33,
27,
13,
44,
32
19
43
12
18
17
20
21
14
15
16
45
46
48
47
10
11
3
2
1
4
5
6
7
8
9
Description
D In
D In
D In
D Out
A In
A Out
D I/O
A I/O
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
Digital Voltage Supply.
Digital Ground.
Positive Analog Voltage Supply.
Analog Ground.
JTAG Test Clock with internal pull-up.
JTAG Test-Mode Select with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is latched on a rising edge of
TCK.
JTAG Test Data Output with internal pull-up. Data is shifted out on TDO on
the falling edge of TCK. TDO output is a tri-state driver.
Crystal Input. This pin is the return for the internal oscillator circuit for a
crystal or ceramic resonator. For a precision internal clock, connect a crystal
or ceramic resonator from XTAL1 to XTAL2. If overdriven by an external
CMOS clock, this becomes the system clock.
Crystal Output. This pin is the excitation driver for a crystal or ceramic
resonator.
Chip Reset. Open-drain output of internal Voltage Supply monitor. Is driven
low when VDD is < 2.8V. An external source can force a system reset by
driving this pin low.
Voltage Reference. When configured as an input, this pin is the voltage
reference for the MCU. Otherwise, the internal reference drives this pin.
Comparator 0 Non-Inverting Input.
Comparator 0 Inverting Input.
Comparator 1 Non-Inverting Input.
Comparator 1 Inverting Input.
No Connect Pin. This pin should be left open.
No Connect Pin. This pin should be left open.
Analog Mux Channel Input 0. (See ADC Specification for complete
description).
Analog Mux Channel Input 1. (See ADC Specification for complete
description).
Analog Mux Channel Input 2. (See ADC Specification for complete
description).
Analog Mux Channel Input 3. (See ADC Specification for complete
description).
Analog Mux Channel Input 4. (See ADC Specification for complete
description).
Analog Mux Channel Input 5. (See ADC Specification for complete
description).
Analog Mux Channel Input 6. (See ADC Specification for complete
description).
Analog Mux Channel Input 7. (See ADC Specification for complete
description).
Table 4.1. Pin Definitions
Rev. 1.2