MCF5329CVM240J Freescale Semiconductor, MCF5329CVM240J Datasheet - Page 22

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MCF5329CVM240J

Manufacturer Part Number
MCF5329CVM240J
Description
IC MPU RISC 240MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF532xr
Datasheet

Specifications of MCF5329CVM240J

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
240MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals
DMA, LCD, PWM, WDT
Number Of I /o
94
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Family Name
MPC5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
240MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.6/1.95/2.75/3.6V
Operating Supply Voltage (min)
1.4/1.7/2.25/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
MA-BGA
Processor Series
MCF532xx
Core
ColdFire V3
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5329CVM240J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
22
1
2
Num
FB4
FB5
FB6
FB7
Timing for chip selects only applies to the FB_CS[5:0] signals. Please see
Timing
The FlexBus supports programming an extension of the address hold. Please consult the Reference Manual
for more information.
Data Input Setup
Data Input Hold
Transfer Acknowledge (TA) Input Setup
Transfer Acknowledge (TA) Input Hold
Characteristics” for SD_CS[3:0] timing.
The processor drives the data lines during the first clock cycle of the transfer
with the full 32-bit address. This may be ignored by standard connected
devices using non-multiplexed address and data buses. However, some
applications may find this feature beneficial.
The address and data busses are muxed between the FlexBus and SDRAM
controller. At the end of the read and write bus cycles the address signals are
indeterminate.
FB_CSn, FB_OE,
Table 9. FlexBus AC Timing Specifications (continued)
FB_BE/BWEn
MCF532x ColdFire
FB_D[31:X]
FB_A[23:0]
FB_CLK
FB_R/W
FB_TS
FB_TA
Characteristic
Figure 7. FlexBus Read Timing
FB1
ADDR[31:X]
®
S0
FB2
Microprocessor Data Sheet, Rev. 5
NOTE
FB6
ADDR[23:0]
S1
DATA
FB4
S2
Symbol
t
t
FB7
t
t
CVFBCH
DVFBCH
FB5
DIFBCH
CIFBCH
Section 5.7.2, “DDR SDRAM AC
S3
FB3
Min
3.5
0
4
0
Freescale Semiconductor
Max
Unit
ns
ns
ns
ns

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