MC9S12XDT256MAG Freescale Semiconductor, MC9S12XDT256MAG Datasheet - Page 655

• Manufacturer Part Number: MC9S12XDT256MAG
• Description: IC MCU 256K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
Signal
CS0
CS1
CS2
CS3
EROMCTL
ROMCTL
Signal
MODC
MODB
MODA
I/O
Table 18-3. External Output Signals Associated with the MMC
O
O
O
O
Table 18-2. External Input Signals Associated with the MMC
I/O
I
I
I
I
I
Chip select line 0
Chip select line 1
Chip select line 2
Chip select line 3
Description
MC9S12XDP512 Data Sheet, Rev. 2.21
EROM control input
ROM control input
Description
Mode input
Mode input
Mode input
NS
SS
Chapter 18 Memory Mapping Control (S12XMMCV3)
Available in Modes
(see
NX
Table
RESET (active low)
RESET (active low)
RESET (active low)
RESET (active low)
RESET (active low)
Latched after
Latched after
Latched after
Latched after
Latched after
Availability
18-4)
ES
EX
ST
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