HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 109

• Manufacturer Part Number: HD64F3664BPV
• Description: MCU 3/5V 32K,PB-FREE 42-DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300H Tinyr

Specifications of HD64F3664BPV

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI
• Peripherals: PWM, WDT
• Number Of I /o: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 42-DIP (0.600", 15.24mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 5.1
5.1.2
Figure 5.5 shows a typical method of connecting a ceramic resonator.
5.1.3
Connect an external clock signal to pin OSC
connection. The duty cycle of the external clock signal must be 45 to 55%.
Frequency (MHz)
R
C
S
0
(max)
(max)
Connecting Ceramic Resonator
External Clock Input Method
Crystal Resonator Parameters
OSC
OSC
Figure 5.5 Typical Connection to Ceramic Resonator
1
2
Figure 5.6 Example of External Clock Input
2
500 Ω
7 pF
OSC
OSC
1
2
C
C
4
7 pF
120 Ω
1
2
1
Open
, and leave pin OSC
C
C
Note: Capacitances are reference values.
1
2
= 30 pF ±10%
= 30 pF ±10%
8
80 Ω
7 pF
External clock input
Rev. 6.00 Mar. 24, 2006 Page 79 of 412
2
open. Figure 5.6 shows a typical
Section 5 Clock Pulse Generators
10
60 Ω
7 pF
REJ09B0142-0600
16
50 Ω
7 pF