D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 210

MCU 3V 0K 144-QFP

D12332VFC25

Manufacturer Part Number
D12332VFC25
Description
MCU 3V 0K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of D12332VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412332VFC25
HD6412332VFC25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12332VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• RAS up mode
Rev.4.00 Sep. 07, 2007 Page 178 of 1210
REJ09B0245-0400
A
CS
CAS, LCAS
D
Note: n = 2 to 5
To select RAS up mode, clear the RCDM bit in MCR to 0. Each time access to DRAM space
is interrupted and another space is accessed, the RAS signal goes high again. Burst operation is
only performed if DRAM space is continuous. Figure 6.22 shows an example of the timing in
RAS up mode. Note that in burst ROM space access, the RAS signal does not return to the
high level.
φ
23
15
n
to A
to D
(RAS)
0
0
Figure 6.22 Example of Operation Timing in RAS Up Mode
T
p
DRAM access
T
r
T
c1
T
c2
DRAM access
T
c1
T
c2
space access
T
External
1
T
2

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