MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 1235

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Special single chip erase and unsecure sequence:
Freescale Semiconductor
1. Reset into special single chip mode.
2. Write an appropriate value to the ECLKDIV register for correct timing.
3. Write 0xFF to the EPROT register to disable protection.
4. Write 0x30 to the ESTAT register to clear the PVIOL and ACCERR bits.
5. Write 0x0000 to the EDATA register (0x011A–0x011B).
6. Write 0x0000 to the EADDR register (0x0118–0x0119).
7. Write 0x41 (mass erase) to the ECMD register.
8. Write 0x80 to the ESTAT register to clear CBEIF.
9. Write an appropriate value to the FCLKDIV register for correct timing.
10. Write 0x00 to the FCNFG register to select Flash block 0.
11. Write 0x10 to the FTSTMOD register (0x0102) to set the WRALL bit, so the following writes
12. Write 0xFF to the FPROT register to disable protection.
13. Write 0x30 to the FSTAT register to clear the PVIOL and ACCERR bits.
14. Write 0x0000 to the FDATA register (0x010A–0x010B).
15. Write 0x0000 to the FADDR register (0x0108–0x0109).
16. Write 0x41 (mass erase) to the FCMD register.
17. Write 0x80 to the FSTAT register to clear CBEIF.
18. Wait until all CCIF flags are set.
19. Reset back into special single chip mode.
20. Write an appropriate value to the FCLKDIV register for correct timing.
21. Write 0x00 to the FCNFG register to select Flash block 0.
22. Write 0xFF to the FPROT register to disable protection.
23. Write 0xFFBE to Flash address 0xFF0E.
24. Write 0x20 (program) to the FCMD register.
25. Write 0x80 to the FSTAT register to clear CBEIF.
26. Wait until the CCIF flag in FSTAT is are set.
27. Reset into any mode.
affect all Flash blocks.
MC9S12XDP512 Data Sheet, Rev. 2.21
Chapter 30 Security (S12X9SECV2)
1237