MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 1259

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Freescale Semiconductor
Conditions are shown in
Num C
10
Restrictions for oscillator in crystal mode apply.
Minimum programming times are achieved under maximum NVM operating frequency f
f
Maximum erase and programming times are achieved under particular combinations of f
to formulae in Sections
Burst programming operations are not applicable to EEPROM
Minimum erase times are achieved under maximum NVM operating frequency, f
Minimum time, if first word in the array is not blank
Maximum time to complete check on an erased block
1
2
3
4
5
6
7
8
9
bus
.
D External oscillator clock
D Bus frequency for programming or erase operations
D Operating frequency
D Flash burst programming consecutive word
D Flash burst programming time for 64 words
D Blank check time Flash per block
D Blank check time EEPROM per block
P Single word programming time
P Sector erase time
P Mass erase time
Table A-4
Section A.3.1.1, “Single Word Programming”
unless otherwise noted
Rating
Table A-17. NVM Timing Characteristics
MC9S12XDP512 Data Sheet, Rev. 2.21
4
4
f
f
Symbol
NVMOSC
NVMBUS
f
–
t
t
NVMOP
t
bwpgm
t
t
swpgm
t
brpgm
check
check
mass
t
Section A.3.1.4, “Mass Erase”
era
NVMOP
1331.2
20.4
100
Min
150
46
20
11
11
0.5
1
2
5
6
6
.
5
2
NVMOP
NVMOP
2
Appendix A Electrical Characteristics
and maximum bus frequency
and bus frequency f
Typ
—
—
—
—
—
—
—
—
—
—
for guidance.
2027.5
65546
2058
74.5
26.7
133
Max
200
80
31
—
1
3
3
3
3
7
7
3
bus
. Refer
MHz
MHz
Unit
kHz
t
t
ms
ms
cyc
cyc
1261
s
s
s