HD64F3437STF16V Renesas Electronics America, HD64F3437STF16V Datasheet - Page 4
HD64F3437STF16V
Manufacturer Part Number
HD64F3437STF16V
Description
MCU 3/5V 60K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300r
Datasheet
1.HD64F3437STF16V.pdf
(755 pages)
Specifications of HD64F3437STF16V
Core Processor
H8/300
Core Size
8-Bit
Speed
16MHz
Connectivity
Host Interface, I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
74
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3437STF16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD64F3437STF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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Cautions
Keep safety first in your circuit designs!
1.
Notes regarding these materials
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Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
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When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
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loss resulting from the information contained herein.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
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