DF2168VTE33 Renesas Electronics America, DF2168VTE33 Datasheet - Page 655

MCU FLASH 3V 256K 33MHZ 144TQFP

DF2168VTE33

Manufacturer Part Number
DF2168VTE33
Description
MCU FLASH 3V 256K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2168VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2168VTE33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
20.1.1
When each mode pin and the FWE pin are set in the reset state and reset start is performed, this
LSI enters each operating mode as shown in figure 20.2.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in boot mode, user
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
program mode, and user boot mode.
programmer mode.
User mode
Operating Mode
FLSHE = 0
→ FWE = 0
FWE = 1 →
FLSHE = 1
Figure 20.2 Mode Transition of Flash Memory
User program
mode
Reset state
On-board programming mode
User boot
Programmer mode setting
mode
RES = 0
Rev. 3.00, 03/04, page 613 of 830
Boot mode
Programmer
mode

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