UPD70F3745GJ-GAE-AX Renesas Electronics America, UPD70F3745GJ-GAE-AX Datasheet - Page 835

• Manufacturer Part Number: UPD70F3745GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3745GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 60K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -AX at the end of the part number are lead-free products.
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
Infrared reflow
Partial heating
Soldering Method
The V850ES/JJ3 should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
μ
μ
μ
μ
PD70F3743GJ-GAE-AX:
PD70F3744GJ-GAE-AX:
PD70F3745GJ-GAE-AX:
PD70F3746GJ-GAE-AX:
2. For soldering methods and conditions other than those recommended above, please contact an Renesas
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
Table 31-1. Surface Mounting Type Soldering Conditions
144-pin plastic LQFP (fine pitch) (20 × 20)
144-pin plastic LQFP (fine pitch) (20 × 20)
144-pin plastic LQFP (fine pitch) (20 × 20)
144-pin plastic LQFP (fine pitch) (20 × 20)
Note
(after that, prebake at 125°C for 20 to 72 hours)
Soldering Conditions
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
IR60-207-3
Condition Symbol
Recommended
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