PIC16C554-04E/SO Microchip Technology, PIC16C554-04E/SO Datasheet - Page 75

• Manufacturer Part Number: PIC16C554-04E/SO
• Description: IC MCU OTP 512X14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C554-04E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• Ram Size: 80 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

10.0
Absolute Maximum Ratings †
Ambient Temperature under bias ...............................................................................................................-40° to +125°C
Storage Temperature ................................................................................................................................ -65° to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power Dissipation (Note 1)...............................................................................................................................1.0W
Maximum Current out of V
Maximum Current into V
Input Clamp Current, I
Output Clamp Current, I
Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA
Maximum Output Current sourced by any I/O pin...................................................................................................25 mA
Maximum Current sunk by PORTA, PORTB and PORTC ....................................................................................200 mA
Maximum Current sourced by PORTA, PORTB and PORTC ...............................................................................200 mA
 2002 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: P
ELECTRICAL SPECIFICATIONS
DD
with respect to V
IK
OK
DD
(V
SS
I
(V0 < 0 or V0 > V
pin .............................................................................................................................250 mA
< 0 or V
pin ..........................................................................................................................300 mA
SS
SS
................................................................................................................. 0 to +7.5V
SS
I
> V
................................................................................................................0 to +14V
(except V
DD
) ........................................................................................................ ±20 mA
DD
).................................................................................................. ±20 mA
DD
Preliminary
and MCLR) .......................................................-0.6V to V
DIS
= V
DD
x {I
DD
- ∑ I
OH
} + ∑ {(V
DD
PIC16C55X
-V
OH
) x I
OH
DS40143D-page 73
} + ∑(V
DD
O
l x I
+0.6V
OL
)