PIC16C554-04E/SO Microchip Technology, PIC16C554-04E/SO Datasheet - Page 96

• Manufacturer Part Number: PIC16C554-04E/SO
• Description: IC MCU OTP 512X14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C554-04E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• Ram Size: 80 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

PIC16C55X
28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
DS40143D-page 94
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-058
Drawing No. C04-080
c
W2
n
eB
E1
W1
E
Dimension Limits
§
2
1
D
A
A1
Units
W2
W1
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
Preliminary
1.430
.170
.155
.015
.300
.285
.135
.008
.050
.016
.345
.130
.290
INCHES*
NOM
1.458
.100
.183
.160
.023
.313
.290
.140
.010
.058
.019
.385
.140
.300
28
B
MAX
B1
1.485
.195
.165
.030
.325
.295
.145
.012
.065
.425
.150
.310
.021
MIN
36.32
4.32
3.94
0.38
7.62
7.24
3.43
0.20
1.27
8.76
3.30
7.37
0.41
MILLIMETERS
 2002 Microchip Technology Inc.
NOM
p
37.02
2.54
4.64
4.06
0.57
7.94
7.37
3.56
0.25
1.46
0.47
9.78
3.56
7.62
28
A2
MAX
37.72
10.80
L
4.95
4.19
0.76
8.26
7.49
3.68
0.30
1.65
0.53
7.87
3.81