XC68HC705B32CB Freescale Semiconductor, XC68HC705B32CB Datasheet - Page 247

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XC68HC705B32CB

Manufacturer Part Number
XC68HC705B32CB
Description
IC MCU 2.1MHZ 32K OTP 56-DIP
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of XC68HC705B32CB

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SCI
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Eeprom Size
256 x 8
Ram Size
528 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
56-SDIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
The MC68HC05B32 is a device similar to the MC68HC05B6, but with increased RAM and ROM
sizes. The entire MC68HC05B6 data sheet applies to the MC68HC05B32, with the exceptions
outlined in this appendix.
G.1
Note:
G.2
When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see
Figure
external clock input. The equivalent specification of the external clock source should be used in
lieu of t
MC68HC05B6
Rev. 4.1
31248 bytes User ROM
No page zero ROM
528 bytes of RAM
52-pin PLCC and 64-pin QFP packages for -40 to +85°C operating temperature range
(extended)
56-pin SDIP package for 0 to 70°C operating temperature range
High speed version not available
D-2). The t
OXOV
Preliminary electrical specifications for the MC68HC05B32 should be taken as being
similar to those for the MC68HC705B32. When silicon is fully available, the part will be
re-characterised and new data made available.
or t
Features
External clock
ILCH
OXOV
.
or t
ILCH
MC68HC05B32
specifications (see
MC68HC05B32
G
Section
H.9) do not apply when using an
Freescale
G-1
14

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