MC9S12UF32PB Freescale Semiconductor, MC9S12UF32PB Datasheet - Page 100

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MC9S12UF32PB

Manufacturer Part Number
MC9S12UF32PB
Description
IC MCU 32K FLASH 30MHZ 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12UF32PB

Core Processor
HCS12
Core Size
16-Bit
Speed
30MHz
Connectivity
ATA, Compact Flash, EBI/EMI, Memory Stick, MMC, SCI, SD, Smart Media, USB
Peripherals
POR, WDT
Number Of I /o
41
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
3.5K x 8
Voltage - Supply (vcc/vdd)
2.25 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

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System on a Chip Guide — 9S12UF32DGV1/D V01.05
A device will be defined as a failure if after exposure to ESD pulses, the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature unless specified otherwise in the device
specification.
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
100
Num C
1
2
3
Human Body
Machine
Latch-up
Model
C Human Body Model (HBM)
C Machine Model (MM)
C
Latch-up Current at T
positive
negative
Table A-3 ESD and Latch-Up Protection Characteristics
Series Resistance
Storage Capacitance
Number of Pulse per pin
positive
negative
Series Resistance
Storage Capacitance
Number of Pulse per pin
positive
negative
Minimum input voltage limit
Maximum input voltage limit
Table A-2 ESD and Latch-up Test Conditions
A
Rating
= 70 C
Description
Symbol
V
V
I
HBM
LAT
MM
Symbol
R1
R1
C
C
-
-
2000
+100
-100
Min
200
Freescale Semiconductor
Value
1500
100
200
-2.5
7.5
1
1
0
1
1
-
-
Max
-
-
-
Unit
Ohm
Ohm
pF
pF
V
V
Unit
mA
V
V

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