MCHC908GR8VFAE Freescale Semiconductor, MCHC908GR8VFAE Datasheet - Page 229

• Manufacturer Part Number: MCHC908GR8VFAE
• Description: IC MCU 8K FLASH 8MHZ 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MCHC908GR8VFAE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number Of I /o: 21
• Program Memory Size: 7.5KB (7.5K x 8)
• Program Memory Type: FLASH
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Technical Data — MC68HC908GR8
17.1 Contents
17.2 Introduction
17.3 Functional Description
MC68HC908GR8 — Rev 4.0
MOTOROLA
NOTE:
NOTE:
17.2
17.3
This section describes the 384 bytes of RAM (random-access memory).
Addresses $0040 through $01BF are RAM locations. The location of the
stack RAM is programmable. The 16-bit stack pointer allows the stack to
be anywhere in the 64K byte memory space.
For correct operation, the stack pointer must point only to RAM
locations.
Within page zero are 192 bytes of RAM. Because the location of the
stack RAM is programmable, all page zero RAM locations can be used
for I/O control and user data or code. When the stack pointer is moved
from its reset location at $00FF out of page zero, direct addressing mode
instructions can efficiently access all page zero RAM locations. Page
zero RAM, therefore, provides ideal locations for frequently accessed
global variables.
Before processing an interrupt, the CPU uses five bytes of the stack to
save the contents of the CPU registers.
For M6805 compatibility, the H register is not stacked.
Freescale Semiconductor, Inc.
For More Information On This Product,
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
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RAM
Section 17. RAM
Technical Data
229