TS922EIJT STMicroelectronics, TS922EIJT Datasheet - Page 14

• Manufacturer Part Number: TS922EIJT
• Description: IC OP AMP R-R DUAL FLIPCHIP
• Manufacturer: STMicroelectronics

Specifications of TS922EIJT

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.3 V/µs
• Gain Bandwidth Product: 4MHz
• Current - Input Bias: 15nA
• Voltage - Input Offset: 1500µV
• Current - Supply: 2mA
• Current - Output / Channel: 80mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-FlipChip
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -

Package information
5
5.1
14/21
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Flip-chip package (8 bumps)
Figure 14. Top view and dimensions of 8-bump flip-chip
Figure 15. Flip-chip footprint recommendation
500µm
500µm
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
Solder mask opening
Solder mask opening
Solder mask opening
500µm
500µm
Φ=250μm
Φ=250μm
Φ=250μm
Φ=400μm
Φ=400μm
Φ=400μm
1600 µm
1600 µm
Doc ID 5150 Rev 8
TS922IJ Footprint
TS922IJ Footprint
∅ 315µm
∅ 315µm
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
500μm
500μm
500μm
1600 µm
1600 µm
600 µm
600 µm
■
■
■
■
■
■
500μm
500μm
500μm
Die size: 1600 µm x 1600 µm ±30 µm
Die height: 350 µm ±20 µm
Die height (including bumps): 600 µm
Bumps diameter: 315 µm ±50 µm
Bumps height: 250 µm ±40 µm
Pitch: 500 µm ±10 µm
150μm min.
150μm min.
150μm min.
75µm min.
75µm min.
75µm min.
100μm max.
100μm max.
100μm max.
Track
Track
Track
TS922, TS922A
®