LP38512MRX-ADJ/NOPB National Semiconductor, LP38512MRX-ADJ/NOPB Datasheet - Page 2

• Manufacturer Part Number: LP38512MRX-ADJ/NOPB
• Description: IC REG LDO 1.5A ADJ 8-PSOP
• Manufacturer: National Semiconductor

Specifications of LP38512MRX-ADJ/NOPB

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.5 ~ 4.5 V
• Voltage - Input: 2.25 ~ 5.5 V
• Number Of Regulators: 1
• Current - Output: 1.5A (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-PSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Current - Limit (min): -
• Other names: LP38512MRX-ADJ

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Ordering Information
Connection Diagrams
Pin Descriptions for TO-263 THIN (TJ) Package
Pin Descriptions for PSOP-8 (MR) Package
Voltage
Output
Pin #
Pin #
DAP
DAP
ADJ
1, 2
7, 8
1
2
3
4
5
3
4
5
6
TO-263 THIN 5-Pin Package
Pin Name
Pin Name
GND
GND
OUT
DAP
OUT
DAP
ADJ
ADJ
N/C
LP38512MRX-ADJ
EN
EN
IN
IN
LP38512MR-ADJ
LP38512TJ-ADJ
Number
Top View
Order
Function
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
must be tied to the input voltage, or actively driven.
Input Supply Pin
Ground
Regulated Output Voltage Pin
The feedback to the internal Error Amplifier to set the output voltage
The TJ-263 DAP is used as a thermal connection to remove heat from the device to an external
heat-sink in the form of the copper area on the printed circuit board. The DAP is physically
connected to backside of the die, but is not internally connected to device ground. The DAP should
be soldered to the Ground Plane copper.
Function
Regulated Output Voltage Pin. Pins share current and must be connected together.
The feedback to the internal Error Amplifier to set the output voltage
No internal connection.
Ground
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
must be tied to the input voltage, or actively driven.
Input Supply Pin. Pins share current and must be connected together.
The PSOP-8 DAP connection is used as a thermal connection to remove heat from the device to
an external heat-sink in the form of the copper area on the printed circuit board. The DAP is
physically connected to backside of the die, but is not internally connected to device ground. The
DAP should be soldered to the Ground Plane copper.
30040905
TO263 THIN
Package
PSOP-8
PSOP-8
Type
2
LP38512MR-ADJ
LP38512MR-ADJ
LP38512TJ-ADJ
Package
Marking
PSOP 8-Pin Package
Top View
30040906
Tape and Reel
Tape and Reel
Supplie
Rail
As