P0080SCMC Littelfuse / Teccor Sidactor(R) Product, P0080SCMC Datasheet - Page 181

• Manufacturer Part Number: P0080SCMC
• Description: SIDACTOR MC BI 6V 400A DO-214AA
• Manufacturer: Littelfuse / Teccor Sidactor(R) Product
• Series: SIDACtor® SC(MC)r

Specifications of P0080SCMC

• Voltage - Breakover: 25V
• Voltage - Off State: 6V
• Voltage - On State: 5V
• Current - Peak Pulse (8 X 20µs): 400A
• Current - Peak Pulse (10 X 1000µs): 100A
• Current - Hold (ih): 50mA
• Number Of Elements: 1
• Capacitance: 75pF
• Package / Case: DO-214AA, SMB
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 5.5 Conductor Width versus Area
© 2002 Teccor Electronics
SIDACtor
®
Data Book and Design Guide
.001
.005
.010
.020
.030
.050
.070
.100
.150
.200
.250
.300
.350
0
0
has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required
conductor width, dependent on the copper foil thickness of the trace.
Trace Separation
Tip and Ring traces are subjected to various transient and overvoltage conditions. To
prevent arcing between traces, minimum trace separation should be maintained. UL 60950
will provide additional information regarding creepage and clearance requirements, which
are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage,
and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd
edition)" on page 4-16 of this data book.
A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation.
Route the Tip and Ring traces towards the edge of the PCB away from areas containing
static sensitive devices.
Grounding
Although often overlooked, grounding is a very important design consideration when laying
out a protection interface circuit. To optimize its effectiveness, several things should be
considered in sequence:
1. Provide a large copper plane with a grid pattern for the Ground reference point.
2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point
(also called centralized) grounding scheme is used for circuit dimensions smaller than
one-tenth of a wavelength (l = 300,000/frequency) and a multi-point (distributed)
grounding scheme is used for circuit trace lengths greater than one-fourth of a
wavelength.
1
5
10
20
Conductor Cross-Section Area (sq mils)
30 50 70
5 - 19
100 150
200
250
300
400
500
http://www.teccor.com
600
[phone]
700
PCB Layout