MCR03EZPFX1303 Rohm Semiconductor, MCR03EZPFX1303 Datasheet - Page 3

• Manufacturer Part Number: MCR03EZPFX1303
• Description: RES 130K OHM 1/10W 1% 0603 SMD
• Manufacturer: Rohm Semiconductor
• Series: MCR03r

Specifications of MCR03EZPFX1303

• Resistance (ohms): 130K
• Power (watts): 0.1W, 1/10W
• Composition: Thick Film
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0603 (1608 Metric)
• Resistance In Ohms: 130K
• Case: 0603 (1608 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Other names: RHM130KHTR; RHM130KSTR; RHM130KSTR

Dimensions (Unit : mm)
Packaging
○
MCR03
c
www.rohm.com
Reel
Bulk case
EIAJ ET-7200B compliamt
2010 ROHM Co., Ltd. All rights reserved.
A
B
Shutter
D
φ180
A
C
−3
0
0.3±0.2
0.3±0.2
φ60
B
+1
1.6±0.1
0
Slider
1
110±0.7
9
6
+1.0
C
5
Label
0
EIAJ ET-7200B compliant
(Unit : mm)
φ13 ± 0.2
12.0±0.1
36
−0.2
D
0
2
3
4
(Unit : mm)
Taping
Narrow pitch (2mm pitch) version
Thick paper
B
Thick paper
mount
0
mount
φ1.5
φ1.5
8.0±0.3
8.0±0.3
3/4
No.
D
D
W
W
1
2
3
4
5
6
+0.1
+0.1
0
0
Heat crimp cover Tape
0
0
Heat crimp cover Tape
Resistive element (Oxide metal thick film)
Silver thick film electrode
Nickel electrode
Sn electrode
Alumina substrate
Overcoating (Resin)
(Underside paper tape) Chip resistor
(Underside paper tape) Chip resistor Square punchout hole
3.5±0.05
3.5±0.05
4.0±0.1
4.0±0.1
P
P
P
P
F
F
2
2
0
0
P
A
0
A
0
P
0
0
P
1
1.75±0.1
1.75±0.1
P
4.0±0.1
2.0±0.5
1
Material
P
P
E
E
1
1
B
0
φD
φD
0
2.0±0.05
2.0±0.05
0
1.1±0.1
1.1±0.1
Square punchout hole
A
P
A
P
0
2
0
2
F
F
(Unit : mm)
(Unit : mm)
Max. 1.1
Max. 1.1
1.9±0.1
1.9±0.1
E
B
T
E
B
T
0
2
0
2
W
W
T
T
2
2
2010.11 - Rev.M
Data Sheet