MCR03EZPFX2003 Rohm Semiconductor, MCR03EZPFX2003 Datasheet - Page 3
![RES 200K OHM 1/10W 1% 0603 SMD](/photos/12/74/127464/mcr03-0603_sml.jpg)
MCR03EZPFX2003
Manufacturer Part Number
MCR03EZPFX2003
Description
RES 200K OHM 1/10W 1% 0603 SMD
Manufacturer
Rohm Semiconductor
Series
MCR03r
Datasheet
1.MCR03EZPJ472.pdf
(5 pages)
Specifications of MCR03EZPFX2003
Resistance (ohms)
200K
Power (watts)
0.1W, 1/10W
Composition
Thick Film
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Height
0.018" (0.45mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0603 (1608 Metric)
Resistance In Ohms
200K
Case
0603 (1608 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
RHM200KHTR
RHM200KSTR
RHM200KSTR
RHM200KSTR
RHM200KSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCR03EZPFX2003
Manufacturer:
ROHM
Quantity:
340 000
Dimensions (Unit : mm)
Packaging
○
MCR03
c
www.rohm.com
Reel
Bulk case
EIAJ ET-7200B compliamt
2010 ROHM Co., Ltd. All rights reserved.
A
B
Shutter
D
φ180
A
C
−3
0
0.3±0.2
0.3±0.2
φ60
B
+1
1.6±0.1
0
Slider
1
110±0.7
9
6
+1.0
C
5
Label
0
EIAJ ET-7200B compliant
(Unit : mm)
φ13 ± 0.2
12.0±0.1
36
−0.2
D
0
2
3
4
(Unit : mm)
Taping
Narrow pitch (2mm pitch) version
Thick paper
B
Thick paper
mount
0
mount
φ1.5
φ1.5
8.0±0.3
8.0±0.3
3/4
No.
D
D
W
W
1
2
3
4
5
6
+0.1
+0.1
0
0
Heat crimp cover Tape
0
0
Heat crimp cover Tape
Resistive element (Oxide metal thick film)
Silver thick film electrode
Nickel electrode
Sn electrode
Alumina substrate
Overcoating (Resin)
(Underside paper tape) Chip resistor
(Underside paper tape) Chip resistor Square punchout hole
3.5±0.05
3.5±0.05
4.0±0.1
4.0±0.1
P
P
P
P
F
F
2
2
0
0
P
A
0
A
0
P
0
0
P
1
1.75±0.1
1.75±0.1
P
4.0±0.1
2.0±0.5
1
Material
P
P
E
E
1
1
B
0
φD
φD
0
2.0±0.05
2.0±0.05
0
1.1±0.1
1.1±0.1
Square punchout hole
A
P
A
P
0
2
0
2
F
F
(Unit : mm)
(Unit : mm)
Max. 1.1
Max. 1.1
1.9±0.1
1.9±0.1
E
B
T
E
B
T
0
2
0
2
W
W
T
T
2
2
2010.11 - Rev.M
Data Sheet