SI2333CDS-T1-GE3 Vishay, SI2333CDS-T1-GE3 Datasheet - Page 2

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SI2333CDS-T1-GE3

Manufacturer Part Number
SI2333CDS-T1-GE3
Description
MOSFET P-CH D-S 12V SOT-23
Manufacturer
Vishay
Series
TrenchFET®r
Datasheet

Specifications of SI2333CDS-T1-GE3

Transistor Polarity
P-Channel
Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
35 mOhm @ 5.1A, 4.5V
Drain To Source Voltage (vdss)
12V
Current - Continuous Drain (id) @ 25° C
7.1A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
25nC @ 4.5V
Input Capacitance (ciss) @ Vds
1225pF @ 6V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
0.035 Ohm @ 4.5 V
Drain-source Breakdown Voltage
12 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
5.1 A
Power Dissipation
1250 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Continuous Drain Current Id
-5.1A
Drain Source Voltage Vds
-12V
On Resistance Rds(on)
59mohm
Rds(on) Test Voltage Vgs
8V
Threshold Voltage Vgs Typ
-1V
Operating Temperature Range
-55°C To +150°C
Transistor Case Style
SOT-23
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
SI2333CDS-T1-GE3TR

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Si2333CDS
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
MOSFET SPECIFICATIONS T
Parameter
Static
Drain-Source Breakdown Voltage
V
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
DS
GS(th)
Temperature Coefficient
Temperature Coefficient
b
a
a
a
a
J
ΔV
Symbol
ΔV
= 25 °C, unless otherwise noted
R
V
GS(th)
I
t
t
I
I
C
V
DS(on)
C
V
GS(th)
D(on)
C
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
DS
g
Q
R
SM
I
t
t
t
DS
oss
t
t
SD
rss
iss
gd
S
rr
a
b
fs
gs
r
f
g
g
rr
/T
/T
J
J
I
V
V
F
I
V
DS
DS
D
= - 1.0 A, dI/dt = 100 A/µs, T
V
DS
= - 1 A, V
DS
= - 6 V, V
= - 6 V, V
= - 12 V, V
V
V
V
V
V
V
V
= - 6 V, V
V
V
DS
GS
GS
GS
DS
V
DS
DS
DS
DS
DD
Test Conditions
= V
≤ - 5 V, V
= - 4.5 V, I
= - 2.5 V, I
= - 1.8 V, I
= 0 V, I
= - 12 V, V
= - 5 V, I
= 0 V, V
I
D
= - 6 V, R
GEN
I
T
GS
GS
f = 1 MHz
S
GS
= - 250 µA
C
= - 1.0 A
GS
GS
= 25 °C
, I
= - 4.5 V, I
= - 2.5 V, I
= - 4.5 V, R
D
D
= 0 V, f = 1 MHz
= 0 V, T
GS
GS
D
= - 250 µA
= - 250 µA
D
D
D
= - 5.3 A
GS
L
= - 5.1 A
= - 4.5 A
= - 2.0 A
= ± 8 V
= - 4.5 V
= 6 Ω
= 0 V
J
D
D
= 55 °C
= - 5.1 A
= - 5.1 A
G
J
= 25 °C
= 1 Ω
Min.
- 0.4
- 12
- 20
0.0285
0.036
0.046
S09-2433-Rev. C, 16-Nov-09
1225
Typ.
18.5
- 0.7
- 13
315
260
2.6
1.9
3.8
4.0
15
13
35
45
12
32
20
16
16
9
Document Number: 68717
± 100
0.035
0.045
0.059
Max.
- 1.0
- 1.2
- 10
- 20
- 1
- 1
25
15
20
60
70
20
50
40
mV/°C
Unit
µA
nC
nC
nA
pF
ns
ns
ns
V
V
A
Ω
S
Ω
A
V

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