DSP56F807VF80 Freescale Semiconductor, DSP56F807VF80 Datasheet - Page 31

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DSP56F807VF80

Manufacturer Part Number
DSP56F807VF80
Description
IC DSP 80MHZ 60K FLASH 160-BGA
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet

Specifications of DSP56F807VF80

Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
136KB (68K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-MAPBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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3.4.3
The recommended method of connecting an external clock is given in
source is connected to XTAL and the EXTAL pin is grounded.
Freescale Semiconductor
Frequency of operation (external clock driver)
Clock Pulse Width
1. See
2. The high or low pulse width must be no smaller than 6.25ns or the chip will not function. However, the high pulse width
does not have to be any particular percent of the low pulse width.
3. Parameters listed are guaranteed by design.
External
Note: The midpoint is V
Clock
External Clock Source
Figure 3-9
Operating Conditions:
Table 3-8 External Clock Operation Timing Requirements
Characteristic
2
for details on using the recommended connection of an external clock driver.
10%
,
50%
90%
3
Figure 3-9 Connecting an External Clock Signal
t
PW
IL
+ (V
56F807 Technical Data Technical Data, Rev. 16
Figure 3-10 External Clock Timing
IH
– V
IL
V
)/2.
SS
= V
1
t
PW
External
SSA
XTAL
Clock
= 0 V, V
56F807
Symbol
f
t
osc
PW
EXTAL
DD
V
SS
= V
DDA
6.25
Min
0
= 3.0–3.6 V, T
Typ
Figure
A
= –40° to +85°C
3-9. The external clock
Max
80
5
External Clock Operation
10%
50%
90%
MHz
V
V
Unit
ns
IH
IL
31

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