WS2411-BLK Avago Technologies US Inc., WS2411-BLK Datasheet - Page 13

• Manufacturer Part Number: WS2411-BLK
• Description: MODULE PA UMTS1900 4X4MM 10-PIN
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS2411-BLK

• Package / Case: 10-DFN
• Current - Supply: 500mA ~ 550mA
• Frequency: 1.85GHz ~ 1.91GHz
• Gain: 24dB ~ 27dB
• Rf Type: W-CDMA, HSPDA
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 1910 MHz
• Operating Supply Voltage: 4.2 V
• Supply Current: 550 mA
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 1 Channel
• Frequency (max): 1.91GHz
• Power Supply Requirement: Dual
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Package Type: SMD
• Dual Supply Voltage (min): 3.2/3.2V
• Dual Supply Voltage (typ): 3.4V
• Dual Supply Voltage (max): 4.2V
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 90C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

13
PCB Design Guidelines
The recommended WS2411 PCB
Land pattern is shown in Figure
25 and Figure 26. The substrate
is coated with solder mask
between the I/O and conductive
paddle to protect the gold pads
from short circuit that is caused
by solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of
solder paste is deposited onto
the PCB pads.
The recommended stencil layout
is shown in Figure 27. Reducing
the stencil opening can poten-
tially generate more voids. On the
other hand, stencil openings
larger than 100% will lead to
excessive solder paste smear or
bridging across the I/O pads or
conductive paddle to adjacent
I/O pads. Considering the fact
that solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use laser cut stencil composed of
0.100 mm (4mils) or 0.127 mm
(5mils) thick stainless steel
which is capable of producing the
required fine stencil outline.
Figure 25. Metallization.
0.85
Figure 26. Solder Mask Opening.
Figure 27. Solder Paste Stencil Aperature.
0.85
0.85
0.5
0.4
0.4
0.25
0.7
0.8
0.7
2.0
0.1
1.6
0.8 x 0.5
0.8 x 0.6
on 0.6mm pitch
Ø 0.3mm
0.6
0.65
0.6
0.6
1.8
1.6