AMMC-5026-W10 Avago Technologies US Inc., AMMC-5026-W10 Datasheet - Page 2

IC MMIC AMP TWA GAAS 2-35GHZ

AMMC-5026-W10

Manufacturer Part Number
AMMC-5026-W10
Description
IC MMIC AMP TWA GAAS 2-35GHZ
Manufacturer
Avago Technologies US Inc.
Type
General Purposer
Datasheets

Specifications of AMMC-5026-W10

Function
Amplifier
Noise Figure Typ
4.3dB
Supply Current
350mA
Supply Voltage Range
7V
Frequency Max
35GHz
Frequency Min
2GHz
Supply Voltage Max
10V
Gain
10.5dB
Number Of Channels
1
Frequency (max)
35GHz
Output Power
24@10000MHzdBm
Power Supply Requirement
Single
Single Supply Voltage (max)
10V
Package Type
Chip
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1846
AMMC-5026-W10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AMMC-5026-W10
Manufacturer:
AVAGO/安华高
Quantity:
20 000
AMMC-5026
2–35 GHz GaAs MMIC Traveling Wave Amplifier
Data Sheet
Description
The AMMC-5026 is a broadband PHEMT GaAs MMIC
Traveling Wave Amplifier (TWA) designed for medium
output power and high gain over the full 2 GHz to 35 GHz
frequency range. The design employs a 6-section cascode
connected FET structure to provide flat gain and medium
power as well as uniform group delay. For improved reli-
ability and moisture protection, the die is passivated at
the active areas.
Applications
• Broadband gain block
• Broadband driver amplifier
• 10 Gb/s Fiber Optics
Absolute Maximum Ratings
Symbol
V
I
V
I
V
I
P
T
T
T
T
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to this
dd
g1
g2
ch
stg
max
dd
in
b
g1
g2
device.
Parameters/Conditions
Positive Drain Voltage
Total Drain Current
First Gate Voltage
First Gate Current
Second Gate Voltage
Second Gate Current
CW Input Power
Channel Temperature
Operating Backside Temperature
Storage Temperature
Max. Assembly Temp (60 sec max)
[1]
Units
V
mA
V
mA
V
mA
dBm
°C
°C
°C
°C
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
Min.
-5
-9
-3
-10
-55
-65
Features
• Frequency range: 2 – 35 GHz
• Gain: 10.5 dB
• Gain flatness: ±0.8 dB
• Return loss:
• Output power (P-1dB):
• Noise figure (6–19 GHz): ≤ 4 dB
Input 17 dB, Output: 15 dB
24 dBm at 10 GHz
23 dBm at 20 GHz
22 dBm at 26 GHz
3050 x 840 µm (119 x 33 mils)
±10 µm (±0.4 mils)
100 ± 10 µm (4 ± 0.4 mils)
75 x 75 µm (2.9 ± 0.4 mils)
Max.
10
450
+5
+3.5
23
+150
+165
+300

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