TEF6730HW/V1,518 NXP Semiconductors, TEF6730HW/V1,518 Datasheet - Page 56

• Manufacturer Part Number: TEF6730HW/V1,518
• Description: IC DIGITAL IF FRONT END 64HTQFP
• Manufacturer: NXP Semiconductors

Specifications of TEF6730HW/V1,518

• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Modulation Or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 85.3mA, 114.7mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Bus Type: I2C
• Maximum Agc: 14 dB
• Maximum Frequency: 288 MHz, 108 MHz
• Minimum Frequency: 144 MHz, 65 MHz
• Modulation Technique: AM, FM
• Mounting Style: SMD/SMT
• Function: Radio
• Noise Figure: 12.9 dB, 6.9 dB
• Operating Supply Voltage: 8.5 V
• Supply Voltage (min): 8 V
• Supply Voltage (max): 9 V
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Frequency: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935278526518; TEF6730HW/V1-T; TEF6730HW/V1-T

Philips Semiconductors
23. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8
8.1
8.1.1
8.1.2
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.7.1
8.2.8
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 27
Thermal characteristics. . . . . . . . . . . . . . . . . . 27
Static characteristics. . . . . . . . . . . . . . . . . . . . 28
Dynamic characteristics . . . . . . . . . . . . . . . . . 29
I
Overall system parameters . . . . . . . . . . . . . . . 43
Application information. . . . . . . . . . . . . . . . . . 45
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 49
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
2
2
C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . 9
C-bus characteristics . . . . . . . . . . . . . . . . . . 41
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
FM mixer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
FM RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Antenna DAA1 and DAA2. . . . . . . . . . . . . . . . . 8
AM LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
AM RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
AM mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCO and dividers . . . . . . . . . . . . . . . . . . . . . . . 9
Tuning PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
AM/FM IF AGC amplifier. . . . . . . . . . . . . . . . . . 9
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Read mode: data byte TUNER . . . . . . . . . . . . 10
Read mode: data byte ID . . . . . . . . . . . . . . . . 11
Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Mode and subaddress byte for write. . . . . . . . 16
Write mode: data byte CONTROL . . . . . . . . . 22
Write mode: data byte PLLM . . . . . . . . . . . . . 23
Write mode: data byte PLLL . . . . . . . . . . . . . . 23
Write mode: data byte DAA . . . . . . . . . . . . . . 23
Write mode: data byte AGC . . . . . . . . . . . . . . 24
Write mode: data byte BAND . . . . . . . . . . . . . 25
Tuning overview . . . . . . . . . . . . . . . . . . . . . . . 26
Write mode: data byte TEST . . . . . . . . . . . . . 26
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 50
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 50
17.4
17.5
18
19
20
21
21.1
21.2
21.3
21.4
22
23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [e-mail].
Footprint for soldering . . . . . . . . . . . . . . . . . . 53
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 54
Revision history . . . . . . . . . . . . . . . . . . . . . . . 54
Legal information . . . . . . . . . . . . . . . . . . . . . . 55
Contact information . . . . . . . . . . . . . . . . . . . . 55
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 51
Package related soldering information . . . . . . 51
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Front-end for digital-IF car radio
Document identifier: TEF6730_1
TEF6730
Date of release: 10 July 2006
All rights reserved.