MC13202FC Freescale Semiconductor, MC13202FC Datasheet - Page 19

IC TXRX RF 2.4GHZ 32-QFN

MC13202FC

Manufacturer Part Number
MC13202FC
Description
IC TXRX RF 2.4GHZ 32-QFN
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC13202FC

Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4
Applications
AMR, HID, HVAC, ISM
Power - Output
-27dBm ~ 3dBm
Sensitivity
-92dBm
Voltage - Supply
2 V ~ 3.4 V
Current - Receiving
37mA
Current - Transmitting
30mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
32-QFN
Operating Supply Voltage
2.7 V
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
8
This section provides application specific information regarding crystal oscillator reference design and
recommended crystal usage.
8.1
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC13202 transceiver provides onboard crystal trim capacitors to assist in meeting this
performance.
The primary determining factor in meeting this specification is the tolerance of the crystal oscillator
reference frequency. A number of factors can contribute to this tolerance and a crystal specification will
quantify each of them:
Freescale requires the use of a 16 MHz crystal with a <9 pF load capacitance. The MC13202 does not
contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher
load capacitance is prohibited because a higher load on the amplifier circuit may compromise its
performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen
across the two terminals of the crystal. The oscillator amplifier configuration used in the MC13202
requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors
are seen to be in series by the crystal, so each must be <18 pF for proper loading.
In the
in conjunction with a crystal that requires an 8 pF load capacitance. The default internal trim capacitor
value (2.4 pF) and stray capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value
for the stray capacitance was determined empirically assuming the default internal trim capacitor value and
for a specific board layout. A different board layout may require a different external load capacitor value.
The on-chip trim capability may be used to determine the closest standard value by adjusting the trim value
via the SPI and observing the frequency at CLKO. Each internal trim load capacitor has a trim range of
approximately 5 pF in 20 fF steps.
Freescale Semiconductor
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
5. Whether or not a frequency trim step will be performed in production
Figure 11
Crystal Oscillator Reference Frequency
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
Crystal Oscillator Design Considerations
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
crystal reference schematic, the external load capacitors are shown as 6.8 pF each, used
MC13202 Technical Data, Rev. 1.5
19

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