AT32UC3C2512C-A2UR Atmel, AT32UC3C2512C-A2UR Datasheet - Page 90
![no-image](/images/manufacturer_photos/0/0/78/atmel_sml.jpg)
AT32UC3C2512C-A2UR
Manufacturer Part Number
AT32UC3C2512C-A2UR
Description
IC MCU AVR32 512K FLASH 64TQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheet
1.AT32UC3C264C-A2UT.pdf
(107 pages)
Specifications of AT32UC3C2512C-A2UR
Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 11x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Data Bus Width
32 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3C2512C-A2UR
Manufacturer:
YAGEO
Quantity:
60 000
8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32117BS–AVR-03/11
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
JA
JC
90.
Table 8-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
90.
θ
HEATSINK
JA
)
51.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
No air flow
No air flow
No air flow
No air flow
TQFP100
TQFP100
LQFP144
LQFP144
Package
TQFP64
TQFP64
QFN64
QFN64
AT32UC3C
Table 8-1 on page
20.0
40.5
39.3
38.1
Typ
0.8
8.7
8.5
8.4
”Power
J
°C/W
°C/W
°C/W
°C/W
in °C.
Unit
90