HFBR-2521ETZ Avago Technologies US Inc., HFBR-2521ETZ Datasheet - Page 4

Fiber Optic Transmitters, Receivers, Transceivers Versatile Link Horiz

HFBR-2521ETZ

Manufacturer Part Number
HFBR-2521ETZ
Description
Fiber Optic Transmitters, Receivers, Transceivers Versatile Link Horiz
Manufacturer
Avago Technologies US Inc.
Series
Versatile Linkr
Datasheet

Specifications of HFBR-2521ETZ

Maximum Forward Current
80 mA
Maximum Power Dissipation
40 mW
Operating Voltage
7 V
Transmission Distance
43 m
Product
Receiver
Data Rate
5 MBd
Wavelength
660 nm
Diode Capacitance
86 pF
Maximum Rise Time
20 ns
Maximum Fall Time
20 ns
Pulse Width Distortion
40 ns
Maximum Output Current
250 uA
Operating Supply Voltage
7 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Data Transmission Distance
38m
Wavelength Typ
660nm
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Voltage - Supply
4.75 V ~ 5.25 V
Power - Minimum Receivable
-21.6dBm
Current - Supply
6.2mA
Applications
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HFBR-2521ETZ
Manufacturer:
ST
Quantity:
21 400
Part Number:
HFBR-2521ETZ
0
Part Number:
HFBR-2521ETZ HFBR-1521ETZ
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
TOP VIEW
(0.100)
2.54
DIMENSIONS IN MILLIMETERS (INCHES).
4
5
3 2
1
8
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
(0.300)
MIN.
7.62
PCB EDGE
(refer to Figure 1)
Vertical Module
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Vertical Modules

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