AT25256B-SSHL-B Atmel, AT25256B-SSHL-B Datasheet - Page 16

• Manufacturer Part Number: AT25256B-SSHL-B
• Description: EEPROM 256Kbit; SPI Bus High Spd; Mode 0 & 3
• Manufacturer: Atmel

Specifications of AT25256B-SSHL-B

• Memory Size: 256Kbit
• Memory Configuration: 32768 X 8
• Interface Type: Serial, SPI
• Clock Frequency: 3MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Density: 256Kb
• Organization: 32Kx8
• Access Time (max): 80ns
• Frequency (max): 5MHz
• Write Protection: Yes
• Data Retention: 100Year
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC
• Operating Temp Range: -40C to 85C
• Supply Current: 10mA
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.2
Table 4-2.
Notes:
16
AT25256B-SSHL-B
AT25256B-SSHL-T
AT25256B-XHL-B
AT25256B-XHL-T
AT25256B-MAHL-T
AT25256B-CUL-T
AT25256B-W11L
AT25256B-WT11L
8S1
8U2-1
8A2
8MA2
AT25256B Ordering Information
Ordering Code
1. “U” designates Green package + RoHS compliant.
2. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
AT25128B/256B [Preliminary]
Serial Interface Marketing.
AT25256B Ordering Information
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-ball, die Ball Grid Array Package (VFBGA)
8-lead, 4.40 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN)
(2)
(2)
(1)
(1)
(2)
(1)
Die in Tape
Package
8U2-1
8MA2
Wafer
8S1
8S1
8A2
8A2
Package Type
Voltage Range
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(• 40°C to 85°C)
(• 40°C to 85°C)
8593C–SEEPR–8/09