BD2270HFV-TR Rohm Semiconductor, BD2270HFV-TR Datasheet - Page 10

• Manufacturer Part Number: BD2270HFV-TR
• Description: MOSFET & Power Driver ICs MOSFET Controller IC For Load Switching
• Manufacturer: Rohm Semiconductor
• Type: MOSFET Controller ICr

Specifications of BD2270HFV-TR

• Package / Case: HVSOF-5
• Product: MOSFET Gate Drivers
• Rise Time: 130 us
• Fall Time: 18 us
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Supply Current: 50 uA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 25 C
• Output Voltage: 9.5 V
• Primary Input Voltage: 5.5V
• No. Of Outputs: 1
• Voltage Regulator Case Style: HVSOF
• No. Of Pins: 5
• Operating Temperature Range: -25°C To +85°C
• Svhc: No SVHC (18-Jun-2010)
• Base: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

●Thermal Derating Characteristics
Cautions on use
© 2009 ROHM Co., Ltd. All rights reserved.
BD2270HFV
www.rohm.com
(HVSOF5)
(1)
(2)
(3)
(4)
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same level
of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the
diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For
the GND line, give consideration to design the patterns in a similar manner.
Absolute Maximum Ratings
Operating conditions
Reverse connection of power supply connector
Power supply line
800
700
600
500
400
300
200
100
0
0
25
Mounted on a 70 mm70 mm1.6 mm glass epoxy PCB
Fig. 39 Power dissipation curve (Pd-Ta Curve)
AMBIENT TEMPERATURE : Ta ( ℃ )
50
10/12
75
100
125
Technical Note
2009.04 - Rev.A
150