L6230PD STMicroelectronics, L6230PD Datasheet - Page 18
![Motor / Motion / Ignition Controllers & Drivers DMOS Driver 3-Phase Brushless DC Motor](/photos/16/14/161432/powerso-36_sml.jpg)
L6230PD
Manufacturer Part Number
L6230PD
Description
Motor / Motion / Ignition Controllers & Drivers DMOS Driver 3-Phase Brushless DC Motor
Manufacturer
STMicroelectronics
Type
DMOS Driverr
Datasheet
1.L6230PD.pdf
(24 pages)
Specifications of L6230PD
Product
Fan / Motor Controllers / Drivers
Operating Supply Voltage
8 V to 52 V
Supply Current
1.4 A
Mounting Style
SMD/SMT
Package / Case
PowerSO-36
Operating Temperature
- 40 C to + 125 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
L6230PD
Manufacturer:
STMicroelectronics
Quantity:
310
Application information
6.4
18/24
Figure 16. Six-step with zero crossing detection typical application
Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be delivered by the device in a safe operating condition. Therefore, it has to
be taken into account very carefully. Besides the available space on the PCB, the right
package should be chosen considering the power dissipation. Heat sinking can be achieved
using copper on the PCB with proper area and thickness.
For instance, using a VFQFPN32L 5 x 5 package the typical R
mounted on a double-layer FR4 PCB with a dissipating copper area of 0.5 cm
side plus 6 cm
Otherwise, using a PowerSO package with copper slug soldered on a 1.5 mm copper
thickness FR4 board with 6cm
is about 35°C/W.
Using a multi-layer board with vias to a ground plane, thermal impedance can be reduced
down to 15°C/W.
2
ground layer connected through 18 via holes (9 below the IC).
2
Doc ID 18094 Rev 1
dissipating footprint (copper thickness of 35 µm), the R
th(JA)
is about 42 °C/W when
2
on the top
L6230
th(jA)