B72540V300K62 EPCOS Inc, B72540V300K62 Datasheet - Page 64

• Manufacturer Part Number: B72540V300K62
• Description: Varistors - MLV Varistor CN2220K30G
• Manufacturer: EPCOS Inc

Specifications of B72540V300K62

• Voltage Rating Dc: 38 V
• Voltage Rating Ac: 30 V
• Clamping Voltage: 77 V
• Peak Surge Current: 1.2 KA
• Capacitance: 4000 pF
• Operating Temperature Range: - 55 C to + 125 C
• Mounting: SMD/SMT
• Tolerance: 10 %
• Package / Case: 2220
• Suppressor Type: Varistor
• Peak Surge Current @ 8/20µs: 1.2kA
• Varistor Case: 2220
• Peak Energy (10/1000us): 12J
• Voltage Rating Vdc: 38V
• Voltage Rating Vac: 30Vrms
• Rohs Compliant: Yes
• Technology: Multilayer Single
• Capacitance Value: 4000pF
• Clamping Current: 10A
• Energy: 12Joule
• Ac Voltage Rating (max): 30VAC
• Dc Voltage Rating (max): 38VDC
• Operating Temp Range: -55C to 125C
• Surge Current (max): 1200A
• Size Code: 2220
• Varistor Voltage: 47V
• Product Length (mm): 5.7mm
• Product Depth (mm): 5mm
• Product Height (mm): 2.5mm
• Product Diameter (mm): Not Requiredmm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: B72540V0300K062

Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Automotive series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 64 of 72
As mounted on substrate