SFECV10M7KA00-R0 Murata, SFECV10M7KA00-R0 Datasheet - Page 11

• Manufacturer Part Number: SFECV10M7KA00-R0
• Description: Filters SFECV10M7KA00-R0
• Manufacturer: Murata
• Type: Ceramic Filterr

Specifications of SFECV10M7KA00-R0

• Product: Ceramic Filters
• Frequency: 10.7 MHz
• Impedance: 330 Ohms
• Operating Temperature Range: - 20 C to + 80 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2
Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested
to approve our product specification or to transact the approval sheet for product specification, before your ordering.
1. Standard Reflow Soldering Condition
(1) Reflow
(2) Soldering Iron
2. Wash
1. The component will be damaged when an excessive
2. The component may be damaged if excess mechanical
3. Design layout of components on the PC board to
4. After installing chips, if solder is excessively applied to
5. When the positioning claws and pick up nozzle are worn,
6. When correcting chips with a soldering iron, the tip of the
7. Do not clean or wash the component as it is not
8. In case of covering filter with over coat, conditions such
9. Do not use strong acidity flux, more than 0.2wt% chlorine
10. Accurate test circuit values are required to measure
10
Chip CERAFILr SFECS Series Notice
Notice (Soldering and Mounting)
Notice (Handling)
Filter shall be soldered at 280 5˚C for 3.0 0.5 seconds.
The soldering iron shall not touch the filter white soldering.
The component cannot be withstand washing.
stress is applied.
stress is applied to it mounted on the printed circuit
board.
minimize the stress imposed on the warp or flexure of the
board.
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremly careful in determining shape and dimension
before designing the circuit board diagram.
the load is applied to the chip while positioning is
concentrated to one positioning accuracy, etc. Careful
checking and maintenance are necessary to prevent
unexpected trouble.
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. The use
of solder containing Ag should be done to prevent the
electrode erosion.
hermetically sealed.
as material of resin, cure temperature, and so on should
be evaluated well.
content, in re-flow soldering.
electrical characteristics.
It may be a cause of mis-correlation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
[Component layout close to board]
Perforation
240
200
100
A
30 sec.
min.
Slit
B
(120-170˚C)
Pre-heating
60-120 sec.
C
(240˚C max.)
Heating
(200˚C)
30 sec.
Peak
max.
Susceptibility to
stress is in the order
of : A>C>B
P61E7.pdf 01.10.17
Gradual
Cooling
120 sec.
min.