SFECV10M7KA00-R0 Murata, SFECV10M7KA00-R0 Datasheet - Page 7

• Manufacturer Part Number: SFECV10M7KA00-R0
• Description: Filters SFECV10M7KA00-R0
• Manufacturer: Murata
• Type: Ceramic Filterr

Specifications of SFECV10M7KA00-R0

• Product: Ceramic Filters
• Frequency: 10.7 MHz
• Impedance: 330 Ohms
• Operating Temperature Range: - 20 C to + 80 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested
to approve our product specification or to transact the approval sheet for product specification, before your ordering.
1. Standard Reflow Soldering Condition
(1) Reflow
(2) Soldering Iron
2. Wash
1. The component will be damaged when an excessive
2. The component may be damaged if excess mechanical
3. Design layout of components on the PC board to
4. After installing chips, if solder is excessively applied to
5. When the positioning claws and pick up nozzle are worn,
6. When correcting chips with a soldering iron, the tip of the
7. Do not clean or wash the component as it is not
8. In case of covering filter with over coat, conditions such
9. Do not use strong acidity flux, more than 0.2wt% chlorine
10. Accurate test circuit values are required to measure
6
Chip CERAFILr SFECV Series Notice
Notice (Soldering and Mounting)
Notice (Handling)
Lead terminal is directly contacted with the tip of
soldering iron of 280 5˚C for 3.0 0.5 seconds.
The component cannot be withstand washing.
stress is applied.
stress is applied to it mounted on the printed circuit
board.
minimize the stress imposed on the warp or flexure of the
board.
the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To
prevent this, be extremely careful in determining shape
and dimension before designing the circuit board
diagram.
the load is applied to the chip while positioning is
concentrated to one positioning accuracy, etc. Careful
checking and maintenance are necessary to prevent
unexpected trouble.
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. the use of
solder containing Ag should be done to prevent the
electrode erosion.
hermetically sealed.
as material of resin, cure temperature, and so on should
be evaluated well.
content, in re-flow soldering.
electrical characteristics.It may be a cause of mis-
correlation if there is any deviation, especially stray
capacitance, from the test circuit in the specification.
[Component direction]
[Component layout close to board]
Perforation
A
240
230
150
Slit
B
60
C
30
5sec.
Gradual Cooling
Time(sec.)
Susceptibility to
stress is in the order
of : A>C>B
P61E7.pdf 01.10.17
Put the
component
lateral to the
direction in
which stress
acts.