SFECV10M7KA00-R0 Murata, SFECV10M7KA00-R0 Datasheet - Page 45

• Manufacturer Part Number: SFECV10M7KA00-R0
• Description: Filters SFECV10M7KA00-R0
• Manufacturer: Murata
• Type: Ceramic Filterr

Specifications of SFECV10M7KA00-R0

• Product: Ceramic Filters
• Frequency: 10.7 MHz
• Impedance: 330 Ohms
• Operating Temperature Range: - 20 C to + 80 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

12
Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested
to approve our product specification or to transact the approval sheet for product specification, before your ordering.
1. Standard Reflow Soldering Condition
(1) Reflow
(2) Soldering Iron
2. Wash
1. The component mounted on the PCB may be damaged if
2. Layout the components on the PCB to minimize the
3. After installing components, if solder is excessively
4. When the positioning claw or pick up nozzle are worn, the
5. When correcting component's position with a soldering
6. Do not clean or wash the component as it is not
7. In case of overcoating the part, coating conditions such
8. Accurate test circuit values are required to measure
44
Chip Type Discriminators CDSCA Series Notice
Notice (Soldering and Mounting)
Notice (Handling)
Lead terminal is directly contacted with the tip of
soldering iron of +280 5 C for 3.0 seconds 0.5 seconds.
The component cannot be withstand washing.
excess mechanical stress is applied.
stress imposed by the warp or flexure of the board.
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to be lower. To
prevent this, be extremely careful in determining shape
and dimension before designing the circuit board diagram.
excess load is applied to the components while
positioning or placing are performed. Careful checking
and maintenance are necessary to prevent unexpected
trouble.
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considerd to prevent the electrode erosion.
hermetically sealed.
as material, curing temperature, and so on must be
evaluated deeply.
electrical characteristics.
It may be a cause of mis-correlation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
[Component direction]
[Component layout close to board]
Perforation
A
260
240
150
Slit
B
C
60
60
5 sec
Time (sec.)
Gradual
Cooling
Susceptibility to
stress is in the order
of : A>C>B
P61E7.pdf 01.10.17
Put the
component
laterally to the
direction in
which stress
acts.