HSP061-8M16 STMicroelectronics, HSP061-8M16 Datasheet - Page 8

• Manufacturer Part Number: HSP061-8M16
• Description: TVS DIODE 3V 8CH BI 16UQFN
• Manufacturer: STMicroelectronics

Specifications of HSP061-8M16

• Mounting Type: Surface Mount
• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Polarization: 8 Channel Array - Bidirectional
• Package / Case: 16-UFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Details
• Other names: 497-11044-2

Recommendation on PCB assembly
4.3
4.4
Note:
8/10
PCB design
1.
2.
Figure 13. Printed circuit board layout recommendations
Reflow profile
Figure 14. ST ECOPACK
Minimize air convection currents in the reflow oven to avoid component movement.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
6 1 6
1
1
1
1
®
Footprint pad
recommended soldering reflow profile for PCB mounting
15
Doc ID 18055 Rev 1
2
90 to 150 sec
90 to 150 sec
2
2
14
3
13
4
3
3
GND
12
5
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
11
6
10
5
5
7
PCB tracks
9
8
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
6°C/s max
Time (min)
Time (min)
7
7
HSP061-8M16