ML610Q428-NNNTBZ03A7 Rohm Semiconductor, ML610Q428-NNNTBZ03A7 Datasheet - Page 9

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ML610Q428-NNNTBZ03A7

Manufacturer Part Number
ML610Q428-NNNTBZ03A7
Description
MCU 8BIT 48K FLASH 128-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q428-NNNTBZ03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
4.2MHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q428-NNNTBZ03A7
Manufacturer:
ROHM
Quantity:
750
Part Number:
ML610Q428-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
Note:
Figure 6 is an image figure of the order of PAD, and it differs from an actual image. Refer to the PAD coordinate for detailed
arrangement.
A chip angle can be checked by the distinguishing mark of three figures.
OKI SEMICONDUCTOR
ML610Q429 Chip Dimension
RESET_N
VDDX
VDDL
TEST
VDD
VPP
VSS
XT0
XT1
VL1
VL2
VL3
VL4
P20
P21
P22
P40
P41
P44
P45
P46
P47
P30
P31
P34
P32
P33
P35
P42
P43
C1
C2
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
94
95
96
97
98
99
ZF8
Device Name
"ZF8"
Chip size:
PAD count:
Minimum PAD pitch:
PAD aperture:
Chip thickness:
Voltage of the rear side of chip:
Figure 6 ML610Q429 Chip Dimension
Device Name
"428"
428
2.99 mm × 3.11 mm
125 pins
80 μm
70 μm × 70 μm
350 μm
V
SS
level
ML610Q428/ML610Q429
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
FEDL610Q428-1
SEG42
SEG41
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
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