STM8L101G2U6 STMicroelectronics, STM8L101G2U6 Datasheet - Page 79
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STM8L101G2U6
Manufacturer Part Number
STM8L101G2U6
Description
IC MCU 8BIT 4KB FLASH 28UFQFPN
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Datasheet
1.STM8L101-EVAL.pdf
(81 pages)
Specifications of STM8L101G2U6
Featured Product
STM32 Cortex-M3 Companion Products
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Infrared, POR, PWM, WDT
Number Of I /o
26
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-UFQFN
Processor Series
STM8L10x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
26
Number Of Timers
3
Operating Supply Voltage
1.65 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Minimum Operating Temperature
- 40 C
Eeprom Size
-
Data Converters
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8L101G2U6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM8L101G2U6A
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM8L101G2U6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM8L101xx
Table 44.
29-Nov-2009
18-Jun-2010
Date
Document revision history (continued)
Revision
8
9
Modified status of the document (datasheet instead of preliminary
data)
Replaced WFQFPN32 with UFQFPN32 and WFQFPN28 with
UFQFPN28.
Modified title of the reference manual mentioned in
Description on page 7
Added references to “low-density” in
page
map on page 23
Modified
Table 7: General hardware register map on page
reserved areas and IR block replaced with IRTIM block
Modified t
power-down on page 41
Modified
Modified
Modified
Table 38: Thermal characteristics on page 65
Modified
Modified
Modified one reserved area (0x00 5055 to 0x00 509F) in
General hardware register map on page 25
ModifiedTable 4: STM8L101xx pin description on page
note 2 and removed “wpu” for PC0 and PC1
Removed one note to
page 46
Modified first paragraph in
Modified OPT3 description in
page 34
Added note 5 to
page 42
Modified V
page 63
Modified
diagram 1) on page 61
Modified COMP_REF availability information in
STM8L101xx ordering information scheme on page 73
Modified
Doc ID 15275 Rev 11
7,
Section 3.5: Memory on page 11
Figure 8: Memory map on page 23
Table 23: LSI oscillator characteristics on page 47
Table 25: Flash program memory on page 49
Table 16: General operating conditions on page 40
Section 10: Package characteristics on page 66
Introduction
Figure 36: Typical application with I2C bus and timing
Section 12.2: Software tools on page 75
TEMP
ESD(CDM)
in
Table 18: Total current consumption in Run mode on
Table 17: Operating conditions at power-up /
in
and
Table 22: HSI oscillator characteristics on
Table 36: ESD absolute maximum ratings on
Description
Section : NRST pin on page 55
Changes
Table 11: Option byte description on
Section 2: Description on
and in
(unique ID are added)
Figure 47:
Figure 8: Memory
25: Modified
Revision history
Section 2:
(t
20: modified
PROG
Table 7:
and
)
79/81