RC28F256P33BFA NUMONYX, RC28F256P33BFA Datasheet - Page 6
![IC FLASH 256MBIT 95NS 64EZBGA](/photos/7/31/73127/rc28f256p33bf_898897_sml.jpg)
RC28F256P33BFA
Manufacturer Part Number
RC28F256P33BFA
Description
IC FLASH 256MBIT 95NS 64EZBGA
Manufacturer
NUMONYX
Series
Axcell™r
Specifications of RC28F256P33BFA
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
256M (16Mx16)
Speed
95ns
Interface
Parallel
Voltage - Supply
2.3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
64-EZBGA
Cell Type
NOR
Density
256Mb
Interface Type
Parallel/Serial
Boot Type
Bottom
Address Bus
25b
Operating Supply Voltage (typ)
2.5/3/3.3V
Operating Temp Range
-40C to 85C
Package Type
EZBGA
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.3V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
32M
Supply Current
50mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
898897
898897
RC28F256P33BF 898897
898897
RC28F256P33BF 898897
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
RC28F256P33BFA
Manufacturer:
Micron Technology Inc
Quantity:
10 000
1.3
Table 1:
Datasheet
6
Flash Die Virtual Chip Enable Truth Table for 512 Mbit Easy BGA Package
Virtual Chip Enable Description
The 512-Mbit P33 Family Flash memory employs a Virtual Chip Enable which combines
two 256-Mbit die with a common chip enable, CE# for Easy BGA packages. Address
A25 is then used to select between the die pair with CE# asserted, depending upon the
package option used. When chip enable is asserted and A25 is low (
parameter die is selected; when chip enable is asserted and A25 is high (
upper parameter die is selected.
Lower Param Die
Upper Param Die
Die Selected
CE#
L
L
Order Number: 320003-09
V
IL
), The lower
A25
H
L
V
IH
), the
P33-65nm
Mar 2010